Goermicro attended the China System-in-Package Conference


The China System-in-Package Conference was held in Shanghai on May 21, 2021. This grand event brought together SIP manufacturers in the whole industry chain. Goermicro showed solutions to all attendees, and some representatives of Goermicro delivered wonderful speeches focusing on the opportunities and challenges of the industry.

Tian Dewen, senior director of Goermicro, made a speech on the application of system-level packaging technology in intelligent terminals, pointing out that Moore’s Law is approaching the physical limits, which is one of the reasons why heterogeneous integrated SiP is promising. This technology could also shorten R&D cycles and reduce costs. The largest market for SiP applications is smartphones, Dr.Tian said, which generally use various SiP modules, including RF front end, power management, camera MEMS, wireless module, CPU, storage module and so on.

The SiP market is expected to grow to $1.88 billion by the end of 2025 with a CAGR of 6% from 2019 to 2025, according to Yole. From the perspective of devices, RF front-end occupies the largest proportion of the overall market. 5G will bring more spectrum and urge phones to use more devices, while using the form of sip modules can stay the same size or even thinner.