Core Competence
Technological Innovation
Thanks to years of R&D investment and technology accumulation, the company has achieved industry-leading technology level in the field of MEMS sensor and SiP, and developed chips with independent intellectual property rights, which enables the company to maintain strong core competitiveness. As of June 30, 2023, the company has mastered 24 core technologies in the field of MEMS devices and microsystem modules and obtained 1866 authorized patents, including 605 invention patents (including 119 overseas invention patents).
One-stop Solution
According to the current situation of the development of industry and the national policy guide, customer demand and their own advantages, Goermicro formed a mature and has its own characteristics of management pattern, Goermicro’s business covers the chip design, product development, packaging test and application of the key link of industrial chain system, through vertical integration, providing customers with “chip + device + module” one-stop product solutions.
Customer resources
By virtue of its one-stop comprehensive service capability, product definition & design competence, rapid response ability to customer demands, large-scale production and high-quality delivery capacity, the company has being well-recognized by customers and established an excellent reputation in the industry. Through its long-term development, the company has also established enduring & stable partnerships with globally renowned manufacturers in the fields of consumer electronics and automotive electronics.
Talents
After years of team building and training, Goermicro has a high-level, professional, scientific research and innovation ability outstanding R&D team and experienced, skilled craft, technology, production team, formed a scientific research, innovative, technical, collaborative talent team. Company core technology staff has profound academic background and long-term industry experience and technical understanding, has the high technology level and research and development capabilities, product line for many years to lead the team in MEMS chip, ASIC chip, MEMS sensor, SiP module implements a number of technological breakthroughs and accumulated fruitful research results.