Goermicro's UniSense platform covers key components required for intelligent sensor interaction solutions, including material development, chip design, packaging and testing, algorithm and software development, and system design.The platform can rapidly scale and adapt full-stack capabilities across applications and provide cost-efficient, high-performance smart sensing interaction solutions in the forms of sensor, SiP and sensing interaction module tailored to customer needs.
we have proactively invested in the development of critical materials for smart sensing interaction solutions
we seamlessly integrate self-developed chips into our solutions
we possess industry-leading packaging and testing processes and capabilities
we have a strategic focus on algorithm and software development in various fields
we possess one-stop system design capabilities
Goermicro has achieved one-stop comprehensive capability in the acoustic field, covering from material development, chip design, packaging and testing, algorithm and software development, as well as system design. This enables us to meet the needs of customers in various fields. Our industry-leading size design, high performance, waterproof and dustproof effects provide terminal products with optimal user experience.
Goermicro’s pressure solution, with the synergies of MEMS and ASIC technologies, achieves high precision and low power consumption in a small size, and is able to adapt to complex temperature environments. With advanced packaging and testing solutions, the solution adapts to various demanding scenarios. In the field of consumer-grade smart wearable, Goermicro, with cutting-edge technologies, has equipped the Internet of Everything with sensitive “pressure tentacles”, driving the industry towards a new journey of intelligence and precision.
Goermicro's inertial solution combines bone voiceprint sensors with noise reduction algorithms to accurately identify sounds and efficiently filter out noises. From the precise command response of smart earphones to the accurate measurement of motion trajectories of wearable devices, Goermicro implants sensitive "sensing chips" into consumer electronics with cutting-edge technologies, leading interactive experiences into a new era of intelligence and precision.
Goermicro's haptic solution is based on the fields of automotive electronics, consumer electronics and smart home appliances, and we are the first manufacturer in the industry to apply piezoelectric materials to automotive electronics and consumer electronics. We use self-developed piezoelectric materials to create high-quality hardware, and use pressure sensing algorithms to provide precise haptic feedback. The one-stop development program covers different terminal products in the fields of automotive electronics, consumer electronics, and smart home appliances, and controls the entire process from design to manufacturing. Leveraging on the synergic advantages of software and hardware, we provide reliable and intelligent haptic solutions for different customers.
Goermicro's optical solution can ensure quality with advanced processes and enhance perception capabilities with precise algorithms. In the field of consumer electronics and smart home appliances, we leverage on our excellent optical strength to break interaction barriers, open a new experience of intelligent perception for users, and lead optical applications towards an intelligent and convenient future.
Goermicro's SiP solution focuses on the fields of consumer electronics, automotive electronics, smart home appliances and industrial application, and grasp customers' core demands for miniaturization, lightness and thinness, and integration. By the integration of self-developed sensors, we can provide precise sensing, efficient integration and reliable embedding to help various terminal products realize miniaturization and high integration. With advanced packaging processes and extensive architectural design capabilities, we can meet the diverse needs of customers. All-round simulation optimization ensures the process quality and performance of products. We provide one-stop solutions for hardware, packaging, simulation and testing, significantly shortening customers' research and development cycles, reducing cost input, and creating highly competitive SiP solutions for customers.