SiP

Goermicro's SiP solution focuses on the fields of consumer electronics, automotive electronics, smart home appliances and industrial application, and grasp customers' core demands for miniaturization, lightness and thinness, and integration. By the integration of self-developed sensors, we provide solutions featuring accurate sensing, efficient integration and reliable embedding to help various terminal products achieve miniaturization and high integration. With advanced packaging processes and extensive architectural design capabilities, we can meet the diverse needs of customers. And we ensure the manufacturing quality and products performance through comprehensive simulation and optimization. We provide one-stop solutions covering hardware, packaging, simulation and testing, which can significantly shorten customers' R&D cycles, reduce cost input, and create highly competitive SiP solutions for customers.

● Integrating self-developed acoustic, pressure, haptic, and optical sensors, and possessing the capability of efficient high-integration and high-reliability packaging

● LGA and BGA single-Sided/double-sided packaging
● 3D stacked die hybrid packaging
● Selective molding with sputtering shielding
● Irregularly outline product packaging and testing
● High-density heterogeneous integration, EMI shielding, and high-reliability system-level packaging and testing

● Molding flow simulation
● Stress and warpage simulation
● Thermal simulation
● Signal integrity simulation
● Power integrity simulation
● RF signal and electromagnetic compatibility simulation

● Possessing system-level design capabilities covering hardware, packaging,simulation, and testing

Solutions

Hardware Design

Hardware Design

Experience in product design
● Smart watch
● Smartphone
● Smart glasses
● TWS
● Automotive DCU/ECU

Experience in hardware system
● Evaluation of customer’s RFI/RFQ files
● Hardware block diagram design
● Power tree design
● Hardware schematic design
● Layout evaluation
● Failure mode and effects analysis
Packaging Design

Packaging Design

Experience in plastic molding design
● Feasibility analysis of packaging solution
● Packaging structure design
● Electromagnetic shielding design
● Packaging DFX design
● High-frequency, high-speed, high-density substrate design

Substrate design experience
● Functional module substrate design
● Smart watch SiP substrate design
● Smart glasses SiP substrate design
● TWS SiP substrate design
● Automotive DCU/ECU substrate design
● Sensor SiP substrate design
Simulation

Simulation

● Signal integrity simulation
● Power integrity simulation
● RF simulation
● Molding flow simulation
● Thermal simulation
● Mechanical simulation
Test and Verification

Test and Verification

EE verification
● Function performance verification
● Audio analysis
● Sequence/logical analysis
● IV Curve & LCR measurement
● Hotspot/thermal imaging analysis
● Manual soldering & Cross-Interchange verification
● Reliability/RMA analysis
● Light intensity testing and chromatic aberration analysis

RF verification
● Tuning and matching
● TDR&SWR testing
● Test fixture development and verification
● Harmonic/spurious testing
● TWS/Watch SIP signaling testing
● Product Loss calibration/S-parameter measurement
● Shielding performance testing
● Probe testing/HW&SW verification

MA verification
● Microscopic analysis: SEM, NIR
● Material analysis: FTIR, EDS, TDM
● Structural analysis: X-ray/CT, SAT,
CSA/P-lapping,
Ultra-prep,
Laser de-cap,
Ion-milling

Goermicro’s SiP solutions can be applied to the following terminal products