Acoustic
Acoustic

Goermicro has achieved one-stop comprehensive capability in the acoustic field, covering from material development, chip design, packaging and testing, algorithm and software development, as well as system design. This enables us to meet the needs of customers in various fields. Our industry-leading ultra-compact size design high performance, waterproof and dustproof effects provide terminal products with optimal user experience.

● Core chips have been successfully developed through self-research and design, which allow us to offer customized solutions.
● Industry-leading packaging and testing technology combined with an information management system ensure stable and reliable product quality
● RNC noise cancellation algorithm improves the quiet driving experience of automotives
● High robustness, special status identification and system function failure prevention can meet the AEC-Q10x standards for automotive electronics
Solutions
  • High-fidelity audio capture solution
    High-fidelity audio capture solution
    Relying on high-performance MEMS acoustic sensor chips, it can restore authentic sound with excellent sensitivity, low distortion and high SNR, providing users with an immersive auditory experience
    ● High SNR: Employing low-noise circuit design and precision manufacturing processes to effectively reduce self-noise and enhances the SNR for clear capture of target sounds
    ● Wide band response: Through covering the frequency range of 20Hz-20kHz, it can reproduce every audio detail and deliver natural and authentic sound quality
    ● Low THD: Reducing harmonic distortion to deliver purer, higher-fidelity sound

    The solution can be applied to the following terminals
  • Integrated acoustic solution
    Integrated acoustic solution
    Leveraging on advanced MEMS acoustic sensor chips, combining precision miniaturized acoustic structures and integrated packaging technology, this solution provides strong support for terminal devices to achieve thinner and more flexible design
    ● Ultra-small packaging: Through advanced packaging technology, ultra-small packaging enables the miniaturization of acoustic sensor products, satisfying the design requirements for sleek and lightweight terminal devices.
    ● High integration: We integrate acoustic sensor chips and necessary circuits, it reduces external components and simplifies system design
    ● Surface Mount Technology (SMT) compatible: Facilitating automated production and improving production efficiency

    The solution can be applied to the following terminals
  • Offline intelligent voice control solution
    Offline intelligent voice control solution
    Combining low-power MEMS acoustic sensor chip with a high-performance digital signal processing (DSP) chip, and deeply integrating neural network algorithms, thereby enables the functions of local voice wake-up and command recognition without network connection
    ● Local voice wake-up: Fast response, no need to connect to cloud servers, protecting user privacy
    ● Command recognition: Supporting multiple voice command recognition, enabling convenient human-machine interaction
    ● Ultra-low power consumption: Implementing local voice wake-up solution with low-power chips effectively avoids frequent activation of the main processor, extending the terminal's battery life

    The solution can be applied to the following terminals
  • Intelligent sound field solution
    Intelligent sound field solution
    Based on multi-acoustic sensor arrays and advanced acoustic algorithms, this solution constructs an intelligent audio perception system, enabling precise sound source localization, excellent noise cancellation and clear voice capture
    ● Precise acoustic sensor array: It adopts a precisely arranged multi-acoustic sensor array module and provides a high-quality foundation for spatial audio sampling
    ● Precisely matched acoustic sensors: Rigorous manufacturing processes and quality control ensure high consistency in performance across every acoustic sensor within the array, enhancing sound source localization and noise cancellation effectiveness
    ● Compact module design: The compact module design is convenient for integration into various terminal devices

    The solution can be applied to the following terminals
  • Comprehensive acoustic protection solution
    Comprehensive acoustic protection solution
    Utilizing high-reliability MEMS acoustic sensor chips and multiple protection technologies, this solution ensures stable operation in harsh environments, helping customers create more durable terminal devices
    ● Waterproof and dustproof design: Utilizing patented structural designs and specialized materials, this solution achieves IP68 waterproof and dustproof standards, and effectively prevents the ingress of dust and water
    ● Anti-electromagnetic interference design: It adopts shielding structures and filtering circuits to suppress electromagnetic interference, ensuring signal accuracy and reliability
    ● High-reliability chips: Selecting rigorously screened and tested MEMS acoustic sensor chips ensures long-term stable operation
    ● Wide operating temperature range: Capable of stable operation within a wide temperature range of -40℃ to +85℃, adapting to various climatic conditions

    The solution can be applied to the following terminals
Contact us for more information
0532-58569385