High SNR for clear sound detail capture and an enhanced voice interaction experience

Wide frequency response to restore natural and authentic sound quality

Low distortion to ensure sound purity

Size: 5.0mm*4.0mm*1.33mm

Sensitivity: -35dB

SNR: 75 dB

AOP: 136dBSPL

Current:<300μA

Ultra-small package size, suitable for thin and light devices

Highly integrated design, simplifying terminal design

Size: 2.25mm*1.75mm*0.8mm

Sensitivity: -37dBFS

SNR: 64dB

AOP: 130dBSPL

Current: < 500μA

Fast local wake-up, protecting user privacy

Multi-command recognition, convenient human-machine interaction

Ultra-low power consumption design, extending terminal battery life

Supports custom wake-up words, applicable to voice interaction and event detection

Size: 3.56mm*2.65mm*1.08mm

Sensitivity: -38dB

SNR: 63dB

AOP: 123dBSPL

Power Consumption:<0.5mW

Efficiently filters particles of 2.5μm and larger, with 99% filtration efficiency for 5μm particles

IP6X dustproof capability, contributing to higher assembly yields

Size: 3.5mm*2.65mm*0.98mm

Sensitivity: -37dBFS

SNR: 65dB

AOP: 131dBSPL

Current: < 1100μA

IP68 waterproof and dustproof, effectively preventing dust and water ingress

Semiconductor process to integrate and mount a waterproof membrane, ensuring superior product consistency

To simplify the overall design and reduce assembly complexity

Size: 3.1mm*2.5mm*0.95mm

Sensitivity: -37dBFS

SNR: 64dB

AOP: 130dBSPL

Current:<600μA

Small-sized packaging adapts to the miniaturization of terminals and simplifies hardware stacking design

To adopt capacitive sensing principle to enhance anti-interference and achieve high precision measurement

To achieve low power consumption and longer battery life of the products through hardware optimization and integration

2mm*2mm*0.76mm/2mm*2.5mm*1.0mm

Absolute Pressure Accuracy: typ. ±0.3hPa

Operating Current: 3 μA (@low power mode)

Small-sized packaging, optimizing the lightness and portability of the whole machine

10ATM waterproof structure, suitable for underwater application scenarios

Capacitive solution - Enhancing anti-interference capability and accuracy

2.7mm*2.7mm*1.7mm

Absolute Pressure Accuracy: typ. ±1hPa

Operating Current: 3 μA(@low power consumption mode)

Measurement of ambient pressure at atmospheric pressure and water depths up to 45m

Small-sized packaging adapts to the miniaturization of terminals and simplifies hardware stacking design

2.7mm*2.7mm*1.7mm

Absolute Pressure Accuracy: typ. ±1hPa

Operating Current: 3 μA(@ow power mode)

Small-sized packaging adapts to the miniaturization of terminals and simplifies hardware stacking design

Single-hole design for the overall machine structure achieves simplicity

Double-layer shielding enhances anti-interference capability

3.5mm*2.65mm*1.0mm

Absolute Pressure Accuracy: ±0.5hPa

Mic SNR: 65dB

High signal-to-noise ratio performance, picking up effective voice vibration signals

To achieve low power consumption and longer battery life of the products through hardware optimization and integration

3.5mm*2.65mm*1.3mm

SNR: ≥77dB

Current: 120/125μA

Small-sized integrated packaging, convenient for terminal machine assembly

High product precision, improving measurement accuracy

Flexible adjustment of measurement distance (short-range, long-range)

4.4mm*2.4mm*1.0mm

Measurement Accuracy: ±3%

Measurement Distance: 5mm~4m

LGA integrated packaging for easy terminal installation

High product precision to improve measurement accuracy

To achieve low power consumption and longer battery life of the products through hardware optimization and integration

17mm*9mm*3.72mm

Measurement Accuracy: ±3% 

Power Consumption: 0.77w@10 FPS

Small-sized multi-channel integrated packaging supports ultra-narrow bezel application design

High sensitivity and low noise enable precise light intensity sensing under concealed installation

To extend battery life of terminals through low power consumption and energy-saving optimization

2mm*1mm*0.5mm

3-in-1 (ALS+RGB+Flicker)

Light intensity measurement level as low as 1 mlux

ADC Noise: 0.05

Local fingertip vibration, with press, slide and vibration feedback functions

Rapid feedback

The vibration module is small in size

Strong vibration

Module Size: 28mm*4.5mm*5.5mm

Maximum Amplitude: 25±5μm

Average Vibration Acceleration: 3g

System Response: ≤10ms

Flexible design: Various shapes such as round, rectangular, square and annular

Simple structure, customized size design

No electromagnetic interference, simple structural requirements

Good high-frequency performance, compensating for traditional speakers

Size: φ10.56mm*1.63mm

Capacitance: 27nF

Resonant Frequency: 20.8kHz

Impedance:  Max 200Ω

Operating Voltage: 0.283Vrms

Flexible design: Various shapes such as circular, rectangular and annular

Flexible size design

High-frequency Clarity

Size: 24.6mm*5.9mm*0.9mm

Capacitance: 4.15μF

Dielectric Loss:<5%@1kHz

Operating Voltage: 2Vrms

Sound Pressure Level:

Sensitivity 1: 79.5±5dB@300Hz,2Vrms,1cm with baffle

Sensitivity 2: 93±5dB@1kHz,2Vrms,1cm with baffle

Localized vibration, clear vibration sensation, and sensitive screen touch while sliding

Suitable for various CMFs, plastic, metal, glass, leather and other surfaces

Anti-false touch, anti-oil stain, low power consumption

The system responds quickly (millisecond-level) with high acceleration

Maximum Amplitude: 15±3μm

Average Vibration Acceleration: 1.5g

System Response: ≤10ms

System SiP for audio smart glasses

• Adopting Bestechnic BES2600YP Bluetooth audio SoC

• Integrating Bluetooth, noise reduction and in-ear detection functions

Size: 17.2mm*4.0mm*2.3mm

CPU: dual-core ARM Cortex-A7

Bluetooth: BT5.3

The industry's smallest-sized System SiP for AR1 platform

• Single-sided molding with shielding layer

• Adopting Qualcomm AR1 Gen1 platform solution

• Internally integrating with CPU, PMIC, Audio PA, Wi-Fi, eMCP, etc.

Size: 32.00mm*10.5mm*3.35mm

CPU: quad-core ARM Cortex-A55

Wi-Fi: IEEE 802.11a/b/g/n/ac/ax

Bluetooth: BT5.3

Storage: 3GB RAM + 16GB ROM

Shooting: 12MP@30fps

TWS Earphone SiP

• Adopting BES2300 platform

• Double-sided molding, selective molding

Size: ϕ13.1mm*2.55mm

Bluetooth: BT5.0

Sensing: G Sensor

BOM: 151 components

UWB+BLE+G-Sensor multi-functional small-sized SiP

• Adopting Qorvo DW3120 sensor

• Supporting Bluetooth connection function

• Certified to FCC standards

Size: 10.5mm*8.3mm*1.2 mm

Processor: ARM Cortex-M4 @64MHz

UWB Standard: IEEE 802.15.4z

Bluetooth: BT5.0

UWB Positioning: Supporting RDoA、PDoA

Data Rate: 6.8Mbps

Consumer-grade UWB SiP

• Integrating NXP SR100T UWB sensor

Size: 7.6mm*4.9mm*1.2mm

Standard: IEEE 802.15.4z

Positioning: Supporting 3D-AoA

Distance Measurement Accuracy: ±10cm

Angle Measurement Accuracy: ±3°

Data Rate: 31.2Mbps

Consumer-grade UWB SiP

• Integrating NXP SR150 multi-protocol UWB SoC

Size: 6.6mm*5.8mm*1.2mm

Standard:IEEE 802.15.4z

Positioning: supporting 3D-AoA

Frequency Band: Channel 5\6\8\9

Distance Measurement Accuracy: ±10cm

Angle Measurement Accuracy: ±3°

Data Rate: 31.2Mbps

Wi-Fi7 SiP

• Integrating Qualcomm WCN7851

• Single-sided molding with shielding layer

• Internally integrating 2.4G/5G FEM, Filter, Diplexer, Crystal, etc.

Size: 13.0mm*9.0mm*1.25mm

Wi-Fi : IEEE 802.11a/b/g/n/ac/ax/be

Frequency: 2.4G/5G/6G

Bluetooth: BT5.4 with LE Audio

Interfaces: PCIe, UART

GNSS SiP

• Adopting SONY CXD5609 chip

• Supporting L1 single-frequency positioning

• Internally integrating Filter, TCXO, etc.

Size: 4.9mm*5.3mm*0.94mm

Network: supporting GPS、GLONASS、

BeiDou、Galileo、QZSS

Frequency: L1

Tracking Sensitivity:-161dBm

Cold Start Sensitivity: -147dBm

Startup Time: 35s for cold start, 2s for hot start

PMIC SiP

• Adopting MAX77734 chip

• Internally integrating Charger, Fuel Gage, DCDC, OLED Driver, etc.

Size: 7.0mm*7.0mm*0.95mm

Charging: 7.5mA-300mA

Static Current: 4.5μA

Shutdown Current: 500nA

PPG SiP

• Integrating MAX86141, MAX30003 chips

• Supporting measurements of heart rate, blood oxygen and electrocardiogram

• Reducing optical crosstalk, improving optical efficiency and enhancing overall performance

Size: 9.75mm*4.75mm*0.85mm

Packaging: LGA-38

Interface: SPI